【英文标准名称】:Attachmentmaterialsforelectronicassembly.Requirementsforsolderingpastesforhigh-qualityinterconnectsinelectronicsassembly
【原文标准名称】:电子组装件用附件材料.电子组装件中高质量互联用焊剂的要求
【标准号】:BSEN61190-1-2-2007
【标准状态】:现行
【国别】:英国
【发布日期】:2007-07-31
【实施或试行日期】:2007-07-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:合金;组装件;化学成分;连接工艺;定义(术语);电气工程;电子工程;电子设备及元件;架设(施工作业);填充料;助熔剂;助熔剂(材料);交货形式;检验;质量保证;形状;软钎料;软钎焊;焊剂;焊锡;回声测深探头;规范(验收);含锡合金;焊接工程;
【英文主题词】:Alloys;Assemblies;Chemicalcomposition;Connectiontechnology;Definitions;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Erecting(constructionoperation);Fillers;Fluxes;Fluxes(materials);Formofdelivery;Inspection;Qualityassurance;Shape;Softsolders;Soldering;Solderingpastes;Solders;Soundingheads;Specification(approval);Tin-containingalloys;Weldingengineering;
【摘要】:ThispartofIEC61190specifiesgeneralrequirementsforthecharacterizationandtestingofsolderpastesusedtomakehigh-qualityelectronicinterconnectionsinelectronicsassembly.Thisstandardservesasaqualitycontroldocumentandisnotintendedtorelatedirectlytothematerial'sperformanceinthemanufacturingprocess.Relatedinformationonfluxcharacterization,qualitycontrolandprocurementdocumentationforsolderfluxandfluxcontainingmaterialmaybefoundinIEC61190-1-1.
【中国标准分类号】:L10;J33
【国际标准分类号】:25_160_50;31_190
【页数】:22P.;A4
【正文语种】:英语